近年来主持国家自然科学基金青年项目1项。
在《J.Am.Chem.Soc.》、《Chem.Sci.》、《Nanoscale》、《J.Phys.Chem.C》等国内外重要刊物上公开发表论文20余篇，其中被SCI收录22篇。
授权国家发明专利2项。
1、Zheng, Qing; Huang, Ximing; Liu, Yao; Fang, Xiaotong; Zhang, Jie; Shao, Huibo, Electrochemical Quantification of Intermolecular Hydrogen Bonding between Ferrocenemethanol and 3-Mercaptopropanoic Acid on Gold. J. Phys. Chem. C 2017. DOI: 10.1021/acs.jpcc.7b06497
2、Zhang, Jie; Zhang, Lin; Wang, Wei; Han, Lianhuan; Jia, Jing-Chun; Tian, Zhao-Wu; Tian, Zhong-Qun; Zhan, Dongping, Contact Electrification Induced Interfacial Reactions and Direct Electrochemical Nanoimprint Lithography in N-Type Gallium Arsenate Wafer. Chem. Sci. 2017, 8 (3), 2407-2412.
3、Zhang, Jie; Zhang, Lin; Han, Lianhuan; Tian, Zhao-Wu; Tian, Zhong-Qun; Zhan, Dongping, Electrochemical Nanoimprint Lithography: When Nanoimprint Lithography Meets Metal Assisted Chemical Etching. Nanoscale 2017, 9 (22), 7476-7482.
4、Zhang, Jie; Lai, Junhui; Wang, Wei; Huang, Pei; Jia, Jingchun; Han, Lianhuan; Tian, Zhao-Wu; Tian, Zhong-Qun; Zhan, Dongping, Etching Kinetics of Iii–V Semiconductors Coupled with Surface Passivation Investigated by Scanning Electrochemical Microscopy. J. Phys. Chem. C 2017, 121 (18), 9944-9952.
5、Zhang, Jie; Dong, Bo-Ya; Jia, Jingchun; Han, Lianhuan; Wang, Fangfang; Liu, Chuan; Tian, Zhong-Qun; Tian, Zhao-Wu; Wang, Dongdong; Zhan, Dongping, Electrochemical Buckling Microfabrication. Chem. Sci. 2016, 7 (1), 697-701.
6、Zhong, Jin-Hui†; Zhang, Jie†; Jin, Xi; Liu, Jun-Yang; Li, Qiongyu; Li, Mao-Hua; Cai, Weiwei; Wu, De-Yin; Zhan, Dongping; Ren, Bin, Quantitative Correlation between Defect Density and Heterogeneous Electron Transfer Rate of Single Layer Graphene. J. Am. Chem. Soc. 2014, 136 (47), 16609-16617.
7、Zhang, Jie; Jia, Jingchun; Han, Lianhuan; Yuan, Ye; Tian, Zhong-Qun; Tian, Zhao-Wu; Zhan, Dongping, Kinetic Investigation on the Confined Etching System of N-Type Gallium Arsenide by Scanning Electrochemical Microscopy. J. Phys. Chem. C 2014, 118 (32), 18604-18611.
1、 詹东平，张杰，田中群，贾晶春，韩联欢，袁野，田昭武，一种复杂三维多级微纳结构的约束刻蚀加工方法，专利号：2013101951283
2、 詹东平，张杰，田中群，田昭武，一种半导体表面微纳米结构的加工方法，专利号：201510458556X
